Method of forming polyimide patterns on substrates

Details Method of forming polyimide patterns on substrates Method of forming polyimide patterns on substrates

1993-10-12

1999-09-21

Nuzzolillo, Maria

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Forming nonplanar surface

4302701, 430192, 430176, 427510, 427520, G03C 500

Patent

active

059552450

ABSTRACT:
Disclosed is a method of forming a pattern on a substrate. A first solution is formed of an organic solvent and monomers of diamine and dianhydride. The monomers are polymerized to form a polyamic acid soluble in the organic solvent. About 20 to about 95% of the amic acid groups in the polyamic acid are imidized to form a partially imidized polyamic acid. A more concentrated solution of the partially imidized polyamic acid is formed. This can be accomplished by precipitating the partially imidized polyamic acid from the first solution and dissolving it in a second organic solvent to form a second solution. The second solution is applied to the substrate and the solvent is evaporated to form a coating of the partially imidized polyamic acid on the substrate. A portion of the coating is removed to form a pattern on the substrate and the remaining partially imidized polyamic acid is fully imidized on the substrate.

REFERENCES:
patent: 4073788 (1978-02-01), Peterson
patent: 4369090 (1983-01-01), Wilson et al.
patent: 4829131 (1989-05-01), Lee
Rhee et al., "Synthesis of Alternating Aromatic Copolyimides", Macromolecules, vol. 26, No. 2, Jan. 18, 1993, pp. 404-406.
Article: "Wet Etch Patterning of Polyimide Siloxane For Electronic Applications" G. C. Davis and C. L. Fasoldt, Proceedings of Second International Conf. on Polyimides: Synthesis, Characterization and Application, Ellenville, NY (1985), pp. 381-388.
Article: "Patternable Silicone Polyimide Copolymers", D. A. Bolan et al, Polyimides: Mater. Chem. Chacter., Proc. Tech. Conf. Polyimides, 3rd, Elsevier, Amsterdam (1989), pp. 103-114.
Article: "Etching of Partially Cured Polyimide", C. E. Diener and J. R. Susko, Polyimides: Synth. Character. Appl., Proc. Tech. Conf. Polyimides, 1st, (1982) edited by K. L. Mittal, vol. 1, Plenum, New York, (1984), pp. 353-364.

Affiliated with

Also associated with

Rating

Method of forming polyimide patterns on substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of forming polyimide patterns on substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of forming polyimide patterns on substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-78781