Semiconductor package

Details Semiconductor package Semiconductor package

1991-10-15

1994-01-25

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257678, H01L 2302

Patent

active

052817598

ABSTRACT:
A semi-conductor package having an insulator formed by a supporting portion, a mounting portion and connecting members, and a layer of electrically conductive material on the insulator in a pattern forming a pad and inner leads connected to the pad by supporting bars. A chip is attached on the pad, and the inner leads are wire-connected to the chip. The pad is vertically offset from the inner leads and the chip is supported in recessed fashion on the pad which shortens the length of the connecting wires whereby the wire-connecting efficiency and the structural stability are improved.

REFERENCES:
patent: 4513355 (1985-04-01), Schroeder et al.
patent: 4761518 (1988-08-01), Butt et al.
patent: 4891687 (1990-02-01), Mallik et al.
patent: 4897508 (1990-01-01), Mahulikar et al.
patent: 4925024 (1990-05-01), Ellenberger et al.
patent: 5012323 (1991-04-01), Farnworth
patent: 5025114 (1991-06-01), Braden
patent: 5041396 (1991-08-01), Valero
patent: 5064706 (1991-11-01), Ueda et al.

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