Method of selective texfturing for patterned polysilicon electro

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

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438398, 438254, 438397, H01L 218242

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058307931

ABSTRACT:
Polysilicon or amorphous silicon electrodes are selectively texturized with respect to neighboring dielectric surfaces. Selectivity of texturizing is partially accomplished by exploiting differences in seed incubation time on silicon as compared to neighboring surfaces. The texturizing process is made substantially completely selective by a texturizing post-etch, which selectively removes parasitic deposits from surfaces adjacent to the silicon electrodes. Selectively texturized electrodes represent a significant improvement in DRAM process integration.

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M. Sakao et al., "A Capacitor-Over-Bit-Line (COB) Cell with a Hemispherical-Grain Storage Note for 4 MB DRAMs", International Electron Devices Meeting 1990., San Francisco, CA USA, 9-12 Dec. 1990.

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