Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer
Patent
1996-09-24
1999-04-27
Tsai, Jey
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
On insulating substrate or layer
438477, H01L 2100, H01L 21322
Patent
active
058973478
ABSTRACT:
Method of fabricating semiconductor devices such as thin-film transistors by annealing a substantially amorphous silicon film at a temperature either lower than normal crystallization temperature of amorphous silicon or lower than the glass transition point of the substrate so as to crystallize the silicon film. Islands, stripes, lines, or dots of nickel, iron cobalt, or platinum, silicide, acetate, or nitrate of nickel, iron, cobalt, or platinum, film containing various salts, particles, or clusters containing at least one of nickel, iron, cobalt, and platinum are used as starting materials for crystallization. These materials are formed on or under the amorphous silicon film.
REFERENCES:
patent: Re28385 (1975-04-01), Mayer
patent: Re28386 (1975-04-01), Heiman et al.
patent: 3783049 (1974-01-01), Sandera
patent: 4231809 (1980-11-01), Schmidt
patent: 5010037 (1991-04-01), Lin et al.
patent: 5075259 (1991-12-01), Moran
patent: 5147826 (1992-09-01), Liu et al.
patent: 5225355 (1993-07-01), Sugino et al.
patent: 5244819 (1993-09-01), Yue
patent: 5264383 (1993-11-01), Young
patent: 5275851 (1994-01-01), Fonash et al.
patent: 5298075 (1994-03-01), Lagendijk et al.
patent: 5300187 (1994-04-01), Lesk et al.
patent: 5403772 (1995-04-01), Zhang et al.
patent: 5422311 (1995-06-01), Woo
patent: 5426064 (1995-06-01), Zhang et al.
patent: 5481121 (1996-01-01), Zhang et al.
patent: 5488000 (1996-01-01), Zhang et al.
patent: 5492843 (1996-02-01), Adachi et al.
patent: 5501989 (1996-03-01), Takayama et al.
patent: 5508533 (1996-04-01), Takemura
patent: 5529937 (1996-06-01), Zhang et al.
patent: 5534716 (1996-07-01), Takemura
patent: 5543352 (1996-08-01), Ohtani et al.
patent: 5563426 (1996-10-01), Zhang et al.
patent: 5569610 (1996-10-01), Zhang et al.
patent: 5569936 (1996-10-01), Zhang et al.
patent: 5580792 (1996-12-01), Zhang et al.
patent: 5585291 (1996-12-01), Ohtani et al.
patent: 5589694 (1996-12-01), Takayama et al.
patent: 5595923 (1997-01-01), Zhang et al.
patent: 5595944 (1997-01-01), Zhang et al.
patent: 5604360 (1997-02-01), Zhang et al.
patent: 5605846 (1997-02-01), Ohtani et al.
patent: 5606179 (1997-02-01), Yamazaki et al.
patent: 5608232 (1997-03-01), Yamazaki et al.
patent: 5612250 (1997-03-01), Ohtani et al.
patent: 5614426 (1997-03-01), Funada et al.
patent: 5614733 (1997-03-01), Zhang et al.
patent: 5616506 (1997-04-01), Takemura
patent: 5620910 (1997-04-01), Teramoto
patent: 5621224 (1997-04-01), Yamazaki et al.
patent: 5624851 (1997-04-01), Takayama et al.
patent: 5637515 (1997-06-01), Takemura
patent: 5639698 (1997-06-01), Yamazaki et al.
patent: 5643826 (1997-07-01), Ohtani et al.
patent: 5646424 (1997-07-01), Zhang et al.
patent: 5654203 (1997-08-01), Ohtani et al.
patent: 5656825 (1997-08-01), Kusumoto et al.
patent: 5663077 (1997-09-01), Adachi et al.
patent: 5677549 (1997-10-01), Takayama et al.
patent: 5696386 (1997-12-01), Yamazaki
patent: 5696388 (1997-12-01), Funada et al.
patent: 5700333 (1997-12-01), Yamazaki et al.
patent: 5705829 (1998-01-01), Miyanaga et al.
patent: 5712191 (1998-01-01), Nakajima et al.
patent: 5756364 (1998-05-01), Tanaka et al.
C. Hayzelden et al., "In Situ Transmission Electron Microscopy Studies of Silicide-Mediated Crystallization of Amorphous Silicon" ( 3 pages).
A.V. Dvurechenskii et al., "Transport Phenomena in Amorphous Silicon Doped by Ion Implantation of 3d Metsls", Akademikian Lavrentev Prospekt 13, 630090 Novosibirsk 90, USSR, pp. 635-640.
T. Hempel et al., "Needle-Like Crystallization of Ni Doped Amorphous Silicon Thin Films", Solid State Communications, vol. 85, No. 11, pp. 921-924, 1993.
"Crystallized Si Films By Low-Temperature Rapid Thermal Annealing of Amorphous Silicon", R. Kakkad, J. Smith, W.S. Lau, S.J. Fonash, J. Appl. Phys. 65 (5), Mar. 1, 1989, 1989 American Institute of Physics, p. 2069-2072.
"Polycrystalline Silicon Thin Film Transistors on Corning 7059 Glass Substrates Using Short Time, Low Temperature Processing", G. Liu, S.J. Fonash, Appl. Phys. Lett. 62 (20), May 17, 1993, 1993 American Institute of Physics, pp. 2554-2556.
"Selective Area Crystallization of Amorphous Silicon Films by Low-Temperature Rapid Thermal Annealing", Gang Liu and S.J. Fonash, Appl. Ohys. Lett. 55 (7), Aug. 14, 1989, 1989 American Institute of Physics, pp. 660-662.
"Low Temperature Selective Crystallization of Amorphous Silicon", R. Kakkad, G. Liu, S.J. Fonash, Journal of Non-Crystalline Solids, vol. 115, (1989), pp. 66-68.
Kawazu et al., "Low-Temperature Crystallization of Hydrogenated Amorphous Silicon Induced by Nickel Silicide Formation", Jap. Journal of Applied Physics, vol. 29, No. 12, Dec. 1990, pp. 2698-2704.
Fortuna et al., In Situ Study of Ion Beam Induced Si Crystallization From a Silicide Interface, Applied Surface Science 73 (1993) pp. 264-267.
S. Wolf, "Silicon Processing for the VLSI ERA" vol. II, pp. 144-46, Jun. 1990.
S.-W. Lee, et al. Appl. Phys. Lett., 66(13) (1995) 1672, "Pd Induced Lateral Crystallization of a-Si . . . ", Mar. 1995.
S. Caune et al., Appl. Surf. Sci., 36(1989) 597 "Combined CW Laser and furnace annealing of a-Si . . . in contact with some metals", 1989.
J.M.Green et al., IBM Tech. Discl. Bulletin, 16(5) (1973) 1612, "Method to purify semiconductor wafers", Oct. 1973.
S.-W. Lee, et al., AM-LCD '95 Proceedings, Page 113, ". . . by Ni Induced Lateral Crytallization of a-Si . . . ", Aug. 1995.
S.F. Gong, et al., J.Appl. Phys., 68(9) (1990) (4542), ". . . Solid State Si-Metal Interactions . . . ", Nov. 1990.
P.H. Robinson, et al., "Use of HCI Gettering in Silicon Device Processing,"J. Electrochem. Soc., V. 118, No. 1, pp. 141-143, Jan., 1971.
Takayama Toru
Takemura Yasuhiko
Uochi Hideki
Yamazaki Shunpei
Zhang Hongyong
Costellia Jeffrey L.
Ferguson Jr. Gerald J.
Lebentritt Michael S.
Semiconductor Energy Laboratory Co,. Ltd.
Tsai Jey
LandOfFree
Semiconductor, semiconductor device, and method for fabricating does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor, semiconductor device, and method for fabricating , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor, semiconductor device, and method for fabricating will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-680972