Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1988-03-23
1989-10-03
Schor, Kenneth M.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156628, 156644, 156646, 1566591, 156668, B29C 3700
Patent
active
048714186
ABSTRACT:
According to a preferred embodiment, arbitrarily shaped holes are fabricated in 0.1 to 2 mm thick plates of polyoxymethylene homo- or copolymers. For that purpose, the polymeric substrate is photoresist-coated on either side; the desired pattern is simultaneously applied to both the front and the back side of the photoresist layers by imagewise exposure at optimum mask alignment; the photoresist layers are developed and blanket-exposed; the resultant photoresist structures are treated with a cyclic organosilicon compound and postbaked; the through holes are produced by sequential reactive ion etching of the polyoxymethylene from the front and the back side, each time down to a depth of about 2/3 of the substrate thickness; and the silylated photoresist masks are stripped from the front and the back side of the substrate.
REFERENCES:
patent: 3811999 (1974-05-01), Fleischer et al.
patent: 3852134 (1974-12-01), Bean
patent: 4240869 (1980-12-01), Diepers
patent: 4262186 (1981-04-01), Provancher
patent: 4284468 (1981-08-01), Stearns
Bartha Johann W.
Bayer Thomas
Greschner Johann
Wittlinger Jurgen
Anderson Andrew J.
Blecker Ira David
International Business Machines - Corporation
Schor Kenneth M.
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