Method of making mask for structuring surface areas

Details Method of making mask for structuring surface areas Method of making mask for structuring surface areas

1982-05-10

1983-11-29

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156644, 156646, 156653, 156656, 156657, 1566591, 148187, 204192E, 430313, H01L 21306, B44C 122, C03C 1500, C23F 102

Patent

active

044179464

ABSTRACT:
A mask for structuring surface areas and a method for manufacture thereof. The mask includes at least one metal layer with throughgoing apertures which define the mask pattern and a semiconductor substrate for carrying the metal layer. The semiconductor substrate has throughholes that correspond to the mask pattern. The throughholes in the semiconductor substrate extend from the metal layer-covered surface on the front to at least one tubshaped recess which extends from the other back surface into the semiconductor substrate. Holes are provided in a surface layer in the semiconductor substrate. The surface layer differs in its doping from the rest of the substrate and the holes which are provided in the surface layer have lateral dimensions larger than the apertures in the metal layer so that the metal layer protrudes over the surface layer.

REFERENCES:
patent: 4021276 (1977-05-01), Cho et al.
patent: 4086127 (1978-04-01), Cresswell
patent: 4256532 (1981-03-01), Magdo et al.

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