Multilayered metallurgical structure for an electronic component

Details Multilayered metallurgical structure for an electronic component Multilayered metallurgical structure for an electronic component

1989-09-05

1991-01-15

Morris, Theodore

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428621, 428651, 428660, 428667, 428672, 428675, H01L 2914

Patent

active

049853104

ABSTRACT:
Disclosed is a multilayered metallurgical structure for an electronic component. The structure includes a base metallurgy which includes one or more layers of chromium, titanium, zirconium, hafnium, niobium, molybdenum, tantalum, cooper and/or aluminum. Directly on the base metallurgy is a layer of cobalt. The structure may also include a layer of noble or relatively noble metal such as gold, platinum, palladium and/or tin directly on the cobalt.

REFERENCES:
patent: Re27934 (1974-03-01), Merrin et al.
patent: 3982908 (1976-09-01), Arnold
patent: 4065588 (1977-12-01), Arnold
patent: 4463059 (1984-07-01), Bhattacharya et al.
patent: 4675243 (1987-06-01), Obinata et al.

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