Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent
1999-05-07
2000-02-22
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
257781, 257706, 257773, 257786, H01L 2348, H01L 2352, H01L 2940
Patent
active
06028367&
ABSTRACT:
A bond pad structure that is equipped with a heat dissipating ring surrounding the pad and a method for forming the structure are disclosed. The bond pad structure includes a bond pad that is substantially surrounded and insulated by a layer of inter-metal-dielectric (IMD) material and is formed of two metal layers and a plurality of metal via plugs connected thereinbetween, and a heat dissipating ring surrounding and spaced-apart from the bond pad formed of an upper conductive ring and a lower conductive ring of substantially the same configuration connected thereinbetween by a plurality of dummy via plugs formed of a thermally conductive material. A method for forming the bond pad structure that is equipped with the heat dissipating ring is further disclosed in which three separate IMD layers are provided for forming photolithographically the bond pad structure and the heat dissipating ring simultaneously.
REFERENCES:
patent: 5248903 (1993-09-01), Heim
patent: 5404047 (1995-04-01), Rostoker et al.
patent: 5736791 (1998-04-01), Fujiki et al.
patent: 5739587 (1998-04-01), Sato
patent: 5923088 (1999-07-01), Shiue et al.
patent: 5959356 (1999-09-01), Oh
Clark Sheila V.
Taiwan Semiconductor Manufacturing Company , Ltd.
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