Integrated circuit chip mold seal

Details Integrated circuit chip mold seal Integrated circuit chip mold seal

1997-12-16

1999-08-24

Ortiz, Angela

Plastic and nonmetallic article shaping or treating: processes

With step of making mold or mold shaping, per se

26427215, 26427217, 264276, B29C 3312, B29C 4514, B29C 7070

Patent

active

059421789

ABSTRACT:
A gasket is provided as a substitute for metal dambars during a process of encapsulating an integrated circuit chip package. The gasket can be in the form of a straight strip for sealing one side of the lead frame or a structure which corresponds in shape and dimension to the entire perimeter of the lead frame. The gasket has grooves formed therein which are defined by projections between adjacent grooves. The depth of each groove is slightly greater than a thickness of the leads. When the gasket is compressed prior to injection of an encapsulation material, the gasket material deforms such that the projections sealingly fill the spaces between leads and the cross-sectional shape of each groove is substantially the same as the cross-sectional shape of the respective lead disposed within the groove.

REFERENCES:
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patent: 5174942 (1992-12-01), Barnadas
patent: 5352633 (1994-10-01), Abbott
patent: 5496435 (1996-03-01), Abbott
patent: 5597523 (1997-01-01), Sakai et al.
patent: 5724730 (1998-03-01), Tanaka
patent: 5744084 (1998-04-01), Chia et al.
patent: 5798070 (1998-08-01), Sakai et al.

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