Plastic encapsulated integrated circuit package and method of ma

Details Plastic encapsulated integrated circuit package and method of ma Plastic encapsulated integrated circuit package and method of ma

1993-05-07

1994-03-22

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

257667, 257666, H01L 2948, H01L 2944, H01L 2952, H01L 2960

Patent

active

052967433

ABSTRACT:
A method of making an integrated circuit package is disclosed herein along with the package itself, which package is encapsulated by plastic that is caused to flow in a given direction during the package's formation. The package itself includes an IC chip having an array of chip output/input terminals, and means for supporting the chip including an array of electrically conductive leads, all of which are provided for connection with the output/input terminals of the IC chip. In addition, the overall package includes bonding wires connecting the chip output/input terminals with respective ones of the leads such that each bonding wire extends in a direction that defines an acute angle of less than 45 degrees with the given flow direction of the plastic material used to encapsulate the IC chip, support means and bonding wires. In a preferred embodiment, at least a portion and most preferably substantially all of the bonding wires are substantially parallel with the given flow direction of the plastic material.

REFERENCES:
patent: 5126823 (1992-06-01), Otsuka et al.
patent: 5155578 (1992-10-01), Lim et al.

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