Method and system for wafer inspection

Details Method and system for wafer inspection Method and system for wafer inspection

2007-02-06

2011-10-18

Norton, Nadine G (Department: 1713)

Etching a substrate: processes

Gas phase etching of substrate

With measuring, testing, or inspecting

C216S037000, C324S216000, C324S076110

Reexamination Certificate

active

08038897

ABSTRACT:
A method for inspecting semiconductor wafers patterned by a photomask includes loading a first wafer and scanning a first image of the first wafer, loading a second wafer and scanning a second image of the second wafer, comparing the first and second images, and classifying a difference detected between the first and second images as a potential defect on the photomask. The potential defect includes a haze defect on the photomask.

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