Plastic ball grid array package with integral heatsink

Details Plastic ball grid array package with integral heatsink Plastic ball grid array package with integral heatsink

2007-04-06

2011-10-04

Nguyen, Khiem D (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S707000, C257S791000, C257S796000, C257SE23101

Reexamination Certificate

active

08030756

ABSTRACT:
A plastic ball grid array semiconductor package employs a metal heat spreader having supporting arms embedded in the molding cap, in which the embedded supporting arms are not directly affixed to the substrate or in which any supporting arm that is affixed to the substrate is affixed using a resilient material such as an elastomeric adhesive. Also, a process for forming the package includes steps of placing the heat spreader in a mold cavity, placing the substrate over the mold cavity such that the die support surface of the substrate contacts the supporting arms of the heat spreader, and injecting the molding material into the cavity to form the molding cap. The substrate is positioned in register over the mold cavity such that as the molding material hardens to form the mold cap the embedded heat spreader becomes fixed in the appropriate position in relation to the substrate.

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Tetsuo Kida, Takashi Haruta and Takashi Yoshioka, “Improving Dry-Film Adhesion,” Optoelectronics Manufacturing Conference, Jul. 2001.

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