Separate layer formation in a semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S218000, C438S424000, C438S631000, C438S637000, C438S778000

Reexamination Certificate

active

08039339

ABSTRACT:
A semiconductor device is formed. A first gate dielectric layer is formed over the semiconductor layer. A first conductive layer is formed over the first gate dielectric. A first separation layer is formed over the first conductive layer. A trench is formed in the semiconductor layer to separate the first mesa and the second mesa. The trench is filled with an isolation material to a height above a top surface of the first conductive layer. The first conductive layer is removed from the second mesa. A second conductive layer is formed over the first separation layer of the first mesa and over the second mesa. A planarizing etch removes the second conductive layer from over the first mesa. A first transistor of a first type is formed in the first mesa, and a second transistor of a second type is formed in the second mesa.

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