Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-07-23
2011-11-29
Phan, Thiem (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S509000, C029S515000, C029S850000, C029S868000
Reexamination Certificate
active
08065789
ABSTRACT:
A method of forming a substrate support comprises providing a body having a groove, inserting a heater element into the groove, disposing an insert into the groove, and inserting a cap into the groove. The heater element comprises a resistive element inside a sheath encased in a malleable cladding. The insert is disposed over the cladding, and the cap is substantially flush with an outer surface of the body.
REFERENCES:
patent: 1969760 (1934-08-01), Reynolds
patent: 2222192 (1940-11-01), Arnold et al.
patent: 2389588 (1945-11-01), Woodman
patent: 2541118 (1951-02-01), Sparklin et al.
patent: 2875312 (1959-02-01), Norton
patent: 5104459 (1992-04-01), Chen et al.
patent: 5422459 (1995-06-01), Zhou
patent: 5844205 (1998-12-01), White et al.
patent: 5963840 (1999-10-01), Xia et al.
patent: 6035101 (2000-03-01), Sajoto et al.
patent: 6087632 (2000-07-01), Mizosaki et al.
patent: 6147334 (2000-11-01), Hannigan
patent: 6180931 (2001-01-01), Futakuchiya et al.
patent: 6348099 (2002-02-01), Xia et al.
patent: 6371357 (2002-04-01), Watanabe
patent: 6376815 (2002-04-01), Watanabe
patent: 6477980 (2002-11-01), White et al.
patent: 6500356 (2002-12-01), Goto et al.
patent: 6506291 (2003-01-01), Tsai et al.
patent: 6552311 (2003-04-01), Watanabe
patent: 6557747 (2003-05-01), Watanabe
patent: 6660975 (2003-12-01), Wang et al.
patent: 6897411 (2005-05-01), Beer et al.
patent: 7154070 (2006-12-01), Watanabe et al.
patent: 2003/0098300 (2003-05-01), Shin
patent: 1020040075178 (2004-08-01), None
patent: 438903 (2001-06-01), None
Office Action dated Jul. 17, 2007 from Taiwanese Patent Office on Application No. 94128097.
Guenther Rolf A.
Hammill Curtis B.
Applied Materials Inc.
Patterson & Sheridan L.L.P.
Phan Thiem
LandOfFree
Method of fabricating a heated substrate support does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of fabricating a heated substrate support, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a heated substrate support will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4275369