Mask-less method and structure for patterning photosensitive...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

Reexamination Certificate

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C430S005000, C430S311000, C355S077000

Reexamination Certificate

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08053178

ABSTRACT:
A method for patterning objects, e.g., semiconductor wafer, glass plate, composite, etc. The method includes providing an object, which has an overlying layer of photosensitive material. The method includes selectively applying light through one or more fiber cores from a plurality of fiber cores. Each of the fiber cores has an input end and an output end. Each of the input ends is coupled to the optical source. The plurality of fiber cores is numbered from 1 through N, where N is an integer greater than 1. Each of the output ends is also numbered from 1 through N, which corresponds respectively to each of the plurality of fiber cores numbered from 1 through N. The method exposes the photosensitive material from light emitted selectively through the one or more fiber cores. The one or more fiber cores out(s) light respectively through one or more output ends of the fiber cores. Each of the output ends numbered from 1 through N is associated with a pixel numbered respectively from 1 through N.

REFERENCES:
patent: 2003/0091277 (2003-05-01), Mei
patent: 2004/0008811 (2004-01-01), Yamamoto
patent: 2004/0165847 (2004-08-01), Kim et al.
patent: 2006/0134535 (2006-06-01), Porque

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