Semiconductor device and method of manufacturing the same

Details Semiconductor device and method of manufacturing the same Semiconductor device and method of manufacturing the same

2010-08-10

2011-11-15

Luu, Chuong A. (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S614000, C438S656000, C438S622000, C438S459000

Reexamination Certificate

active

08058165

ABSTRACT:
A method of manufacturing according to an embodiment of the present invention includes forming a seed metal layer20aon a supporting substrate70, forming an interconnect layer10including an interconnect18on the seed metal layer20a, removing the supporting substrate70after forming the interconnect layer10, and patterning the seed metal layer20athus to form an interconnect20after removing the supporting substrate.

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