4. Plastic and nonmetallic article shaping or treating: processes
  5. Heat polishing of inorganic article surface outside of mold

Koji Soejima

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Bump structure and method for making the same

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Electronic device and method of manufacturing the same

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Fabrication method of plastic-molded lead component

Plastic and nonmetallic article shaping or treating: processes – Heat polishing of inorganic article surface outside of mold
Patent

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IC package and IC probe card with organic substrate

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Method for making a bump structure

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-882150

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