Method for forming conductive structures

Details Method for forming conductive structures Method for forming conductive structures

2007-07-10

2010-11-16

Toledo, Fernando L (Department: 2895)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S618000, C438S622000, C438S687000, C438S629000, C438S672000, C257SE21545, C257SE21546

Reexamination Certificate

active

07833893

ABSTRACT:
A method of forming a method a conductive wire. The method includes forming a dielectric hardmask layer on a dielectric layer; forming an electrically conductive hardmask layer on the dielectric hardmask layer; forming a trench extending through the conductive and dielectric hardmask layers into the dielectric layer; depositing a liner/seed layer on the conductive hardmask layer and the sidewalls and bottom of the trench; filling the trench with a fill material; removing the liner/seed layer from the top surface of the conductive hardmask layer; removing the fill material from the trench; electroplating a metal layer onto exposed surfaces of the conductive hardmask layer and liner/seed layer; and removing the metal layer and the conductive hardmask layer from the dielectric hardmask layer so the metal layer and edges of the liner/seed layer are coplanar with the top surface of the dielectric hardmask layer.

REFERENCES:
patent: 4666556 (1987-05-01), Fulton et al.
patent: 5008216 (1991-04-01), Huang et al.
patent: 5047815 (1991-09-01), Yasuhira et al.
patent: 5223447 (1993-06-01), Lee et al.
patent: 5665202 (1997-09-01), Subramanian et al.
patent: 5786263 (1998-07-01), Perera
patent: 5963828 (1999-10-01), Allman et al.
patent: 6051880 (2000-04-01), Kikuta
patent: 6093966 (2000-07-01), Venkatraman et al.
patent: 6117782 (2000-09-01), Lukanc et al.
patent: 6140223 (2000-10-01), Kim et al.
patent: 6251528 (2001-06-01), Uzoh et al.
patent: 6251753 (2001-06-01), Yeh et al.
patent: 6258692 (2001-07-01), Chu et al.
patent: 6291332 (2001-09-01), Yu et al.
patent: 6368484 (2002-04-01), Volant et al.
patent: 6429134 (2002-08-01), Kubota et al.
patent: 6486055 (2002-11-01), Jung et al.
patent: 6486057 (2002-11-01), Yeh et al.
patent: 6534378 (2003-03-01), Ramkumar et al.
patent: 6573601 (2003-06-01), Dennison et al.
patent: 6677232 (2004-01-01), Hong et al.
patent: 6720232 (2004-04-01), Tu et al.
patent: 6812144 (2004-11-01), Shim
patent: 6818552 (2004-11-01), Daniels et al.
patent: 6825561 (2004-11-01), Agarwala et al.
patent: 6831310 (2004-12-01), Mathew et al.
patent: 6897508 (2005-05-01), Sneh
patent: 6914316 (2005-07-01), Yun et al.
patent: 6927138 (2005-08-01), Takenaka
patent: 7091133 (2006-08-01), Goundar et al.
patent: 7138337 (2006-11-01), Lin
patent: 7176123 (2007-02-01), Kim et al.
patent: 7282447 (2007-10-01), Dennison et al.
patent: 7312131 (2007-12-01), Wu
patent: 7332396 (2008-02-01), Lin et al.
patent: 7387943 (2008-06-01), Kim et al.
patent: 7416987 (2008-08-01), Hieda et al.
patent: 7442979 (2008-10-01), Shea
patent: 7504725 (2009-03-01), Kim et al.
patent: 2001/0014525 (2001-08-01), Ireland
patent: 2001/0027019 (2001-10-01), Ishii et al.
patent: 2002/0135040 (2002-09-01), Li et al.
patent: 2003/0143322 (2003-07-01), Ning
patent: 2003/0166345 (2003-09-01), Chang
patent: 2004/0036051 (2004-02-01), Sneh
patent: 2004/0212086 (2004-10-01), Dotta et al.
patent: 2005/0020090 (2005-01-01), Dennison et al.
patent: 2005/0153538 (2005-07-01), Tsai et al.
patent: 2005/0170661 (2005-08-01), Economikos et al.
patent: 2006/0063375 (2006-03-01), Sun et al.
patent: 2006/0088977 (2006-04-01), Yang
patent: 2006/0192266 (2006-08-01), Willer et al.
patent: 2006/0234443 (2006-10-01), Yang et al.
patent: 2006/0276041 (2006-12-01), Uchikura et al.
patent: 2007/0004190 (2007-01-01), Dambrauskas et al.
patent: 2007/0059915 (2007-03-01), Akram
patent: 2007/0077720 (2007-04-01), Heineck et al.
patent: 2007/0155119 (2007-07-01), Muemmler et al.
patent: 2007/0164443 (2007-07-01), Florian et al.
patent: 2007/0190742 (2007-08-01), Chou et al.
patent: 2007/0249129 (2007-10-01), Hall et al.
patent: 2007/0281487 (2007-12-01), Dennison et al.
patent: 2008/0020503 (2008-01-01), Sheats et al.
patent: 2008/0253097 (2008-10-01), Kawano
patent: 2008/0283960 (2008-11-01), Lerner

Affiliated with

Also associated with

Rating

Method for forming conductive structures does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming conductive structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming conductive structures will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4251940