Integrated circuit package system including shield

Details Integrated circuit package system including shield Integrated circuit package system including shield

2006-05-22

2010-06-01

Lee, Eugene (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S659000, C257S708000, C257S728000, C257S730000, C257S732000, C257SE23114, C361S816000, C438S121000

Reexamination Certificate

active

07728417

ABSTRACT:
A method of manufacture of an integrated circuit package system which includes providing a substrate and attaching a first device to the substrate. Attaching a shield to the substrate. Processing the shield to form apertures and configuring the shield to block electromagnetic energy that passes through the apertures.

REFERENCES:
patent: 4339628 (1982-07-01), Marcantonio et al.
patent: 5354951 (1994-10-01), Lange et al.
patent: 5763824 (1998-06-01), King et al.
patent: 6628524 (2003-09-01), Washino et al.
patent: 6757181 (2004-06-01), Villanueva et al.
patent: 6777819 (2004-08-01), Huang
patent: 2004/0077329 (2004-04-01), Asano et al.
patent: 2004/0084198 (2004-05-01), Seidler
patent: 2004/0124518 (2004-07-01), Karnezos

Affiliated with

Also associated with

Rating

Integrated circuit package system including shield does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit package system including shield, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit package system including shield will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4243139