Method for making micro-electromechanical system devices

Details Method for making micro-electromechanical system devices Method for making micro-electromechanical system devices

2008-10-02

2010-11-02

Toledo, Fernando L (Department: 2895)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S106000, C438S107000, C438S108000, C438S109000, C438S120000, C438S110000, C438S111000, C438S112000, C438S113000, C438S114000, C438S115000, C438S116000, C438S117000, C438S118000, C438S119000, C438S121000, C438S122000, C438S123000, C438S124000, C438S125000, C438S126000, C438S127000, C257S790000, C257SE21502, C257SE21499, C257S019000

Reexamination Certificate

active

07824945

ABSTRACT:
A method for making micro-electromechanical system devices includes: (a) forming a sacrificial layer on a device wafer; (b) forming a plurality of loop-shaped through-holes in the sacrificial layer so as to form the sacrificial layer into a plurality of enclosed portions; (c) forming a plurality of cover caps on the sacrificial layer such that the cover caps respectively enclose the enclosed portions of the sacrificial layer; (d) forming a device through-hole in each of active units of the device wafer so as to form an active part suspended in each of the active units; and (e) removing the enclosed portions of the sacrificial layer through the device through-holes in the active units of the device wafer.

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