Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2009-03-03
2010-10-05
Fahmy, Wael M (Department: 2814)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257S759000, C257SE21507, C438S233000, C438S244000, C438S253000, C438S638000, C438S667000
Reexamination Certificate
active
07807569
ABSTRACT:
In one embodiment, a semiconductor device comprises a conductive pad formed in a semiconductor substrate. The semiconductor device further includes a conductive pattern overlying a peripheral region of the conductive pad. The conductive pattern has an opening to expose another region of the conductive pad. The semiconductor device also includes a conductive contact extending through the opening. The conductive contact is electrically connected to the conductive pad. As a result, manufacturing cost for the semiconductor device may be reduced while manufacturing throughput may be improved.
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Fahmy Wael M
Harness & Dickey & Pierce P.L.C.
Ingham John C
Samsung Electronics Co,. Ltd.
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