Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-07-18
2010-10-05
Bryant, Kiesha R (Department: 2891)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
Reexamination Certificate
active
07807561
ABSTRACT:
After plural semiconductor elements are stacked to form a stacked body P, side wirings are formed on the side surface of the stacked body P, thereby manufacturing a semiconductor apparatus in which the respective semiconductor elements are electrically connected to one another. In this case, as the semiconductor element, a semiconductor element10is employed in which a gold wire16with its one end connected to an electrode terminal of the semiconductor element is extended out to the side surface. A conductive paste36containing conductive particles applied over a predetermined length of a transferring wire30is transferred to the side surface of the stacked body P so that the gold wires16extended out to the side surfaces of the semiconductor elements10, 10, 10are connected, thereby forming the side wirings.
REFERENCES:
patent: 6445063 (2002-09-01), King et al.
patent: 7180168 (2007-02-01), Imai
patent: 2001-514449 (2001-09-01), None
Higashi Mitsutoshi
Kurihara Takashi
Mizuno Shigeru
Murayama Kei
Shiraishi Akinori
Bryant Kiesha R
Drinker Biddle & Reath LLP
Shinko Electric Industries Co. Ltd.
Wagner Jenny L
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