Forming a buried bit line in a bulb-shaped trench

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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Details

C438S701000, C257S331000, C257SE21658, C257SE29257

Reexamination Certificate

active

07858477

ABSTRACT:
A method for manufacturing a semiconductor device includes forming a bulb-type trench separated from a surrounding gate and forming a buried bit line in the bulb-type trench, thereby preventing electric short of a word line and the buried bit line. A semiconductor device includes a vertical pillar formed over a semiconductor substrate, a surrounding gate formed outside the vertical pillar, and a buried bit line separated from the surrounding gate.

REFERENCES:
patent: 7368352 (2008-05-01), Kim et al.
patent: 2005/0054158 (2005-03-01), Divakaruni et al.
patent: 2007/0012996 (2007-01-01), Yoon et al.
patent: 2007/0080385 (2007-04-01), Kim et al.
patent: 2007/0082448 (2007-04-01), Kim et al.
patent: 2007/0181925 (2007-08-01), Yoon et al.
patent: 2009/0256194 (2009-10-01), Kim et al.
patent: 2010/0096693 (2010-04-01), Hong
patent: 100660881 (2006-12-01), None
patent: 10-2007-0009140 (2007-01-01), None

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