Method of providing a positive resist pattern

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

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430328, 430394, G03C 500

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active

058769048

ABSTRACT:
A method of forming a positive resist pattern comprising the steps of: (A) forming a positive resist film on a substrate; (B) irradiating the resist film with an active ray for patterning; (C) exposing the whole surface of the resist film to a light beam with a predetermined light exposure amount that causes substantially no film thickness reduction after development, the light beam being absorbed by the resist film and different from the active ray used for patterning; and (D) carrying out development after the irradiation for patterning and the exposure of the whole surface, which method forms a positive resist pattern, while depressing formation of a surface inhibition layer of the resist film and improving the affinity of the surface of the resist film to a developer, thereby improving the performance of the resist.

REFERENCES:
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patent: 4444869 (1984-04-01), Chonan et al.
patent: 4618564 (1986-10-01), Demmer et al.
patent: 5206117 (1993-04-01), Labadie et al.
Lamola et al. Chemically Amplified Resists, Solid State Technology, Aug. 1991, pp. 53-59.
(Text of Paper) Yamamoto et al., "Investigation of Post Exposure Delay Effect on Positive Type Chemical Amplification EB Resists," 30p-MB-4.
(Text of Paper) Usujima et al., "Influence of Surfactant in Resist on Pattern," 27p-ZW-7.
(Text of Paper) Hirano et al., "Micro Bubble Defect Reduction on Photolithography," 27P-ZW-9.

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