Method for manufacturing semiconductor device

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step

Reexamination Certificate

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Details

C438S629000, C438S646000, C438S687000, C438S689000, C438S712000, C438S148000, C430S322000, C430S312000, C430S323000, C430S324000, C257S062000, C257S762000

Reexamination Certificate

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07732334

ABSTRACT:
It is an object of the present invention to provide a method for manufacturing a substrate having film patterns such as an insulating film, a semiconductor film, and a conductive film in simple processes. It is another object of the invention to provide a method for manufacturing a semiconductor device with high throughput and high yield at low cost. A method for manufacturing a semiconductor device including the steps of: forming a first film over a substrate; discharging a solution containing a mask material to the first film thereby forming a mask over the first film; patterning the first film with the use of the mask thereby forming low wettability regions and a high wettability region over the substrate; removing the mask; and discharging a solution containing a material of an insulating film, a semiconductor film, or a conductive film to the high wettability region provided between the low wettability regions thereby forming a pattern of the insulating film, the semiconductor film, or the conductive film.

REFERENCES:
patent: 6303277 (2001-10-01), Hieda et al.
patent: 6734029 (2004-05-01), Furusawa
patent: 6812136 (2004-11-01), Koyama et al.
patent: 6838361 (2005-01-01), Takeo
patent: 6847069 (2005-01-01), Park et al.
patent: 2002/0151161 (2002-10-01), Furusawa
patent: 2003/0143845 (2003-07-01), Mori et al.
patent: 2004/0005742 (2004-01-01), Ohtani et al.
patent: 1462484 (2003-12-01), None
patent: 2000-39213 (2000-02-01), None
patent: 2000-89213 (2000-03-01), None
patent: 2002-164635 (2002-06-01), None
patent: WO 02/073712 (2002-09-01), None
Office Action, (Application No. 200510091142.4; CN08101), dated Aug. 14, 2009 with English Translation.

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