Photosensitive polyimide composition, polyimide film and...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S326000, C430S330000, C430S906000

Reexamination Certificate

active

07745096

ABSTRACT:
A photosensitive polyimide composition, a polyimide film, and a semiconductor device using the same are disclosed. The photosensitive polyimide composition can be cured by heating. A polyhydroxyimide is used as a base resin and can be mixed with a photoacid generator and a cross-linking agent having two or more vinylether groups. A film of the photosensitive polyimide composition can be developed by treatment with an alkaline aqueous solution. Embodiments of the invention enable improvement in production yield and reliability in a highly-integrated memory semiconductor packaging processes.

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