Substrate thickness measuring during polishing

Details Substrate thickness measuring during polishing Substrate thickness measuring during polishing

2008-08-04

2010-02-02

Shechtman, Sean P (Department: 2121)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S108000, C700S121000, C700S175000, C438S007000, C451S005000, C451S006000

Reexamination Certificate

active

07657342

ABSTRACT:
A computer program product that determines a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matches the spectra with indexes in a library and uses the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.

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