Semiconductor package and semiconductor package mounting method

Details Semiconductor package and semiconductor package mounting method Semiconductor package and semiconductor package mounting method

2005-11-14

2009-06-02

Luu, Chuong Anh (Department: 2892)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

By reaction with substrate

C257S797000, C257S730000, C257S786000

Reexamination Certificate

active

07541294

ABSTRACT:
To provide a semiconductor package mounting method, with excellent work efficiency, wherein the direction of a semiconductor package can be verified by a simple method before mounting. One corner of a square shaped display section provided on the surface of a semiconductor package body is chamfered such that the chamfer dimensions are different from those of the other corners. If image recognition by a camera determines that this chamfered part is located correctly, the orientation of a semiconductor package is determined to be correct. On the other hand, if image recognition determines that it is not located correctly, the orientation of the semiconductor package is adjusted until it is correct.

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