Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2006-07-24
2009-06-02
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C257SE21550
Reexamination Certificate
active
07541244
ABSTRACT:
A method of fabricating a semiconductor device having a trench gate is provided. First, a semiconductor substrate having a trench etch mask thereon is provided. The semiconductor substrate is etched to form a first trench having a first depth using the trench etch mask as a shield. Impurities are doped into the semiconductor substrate through the first trench to form a doped region. The doped region and the semiconductor substrate underlying the first trench are etched to form a second trench having a second depth greater than the first depth, wherein the second trench has a sidewall and a bottom. A gate insulating layer is formed on the sidewall and the bottom of the second trench. A trench gate is formed in the second trench.
REFERENCES:
patent: 5183775 (1993-02-01), Levy
patent: 5424231 (1995-06-01), Yang
patent: 6150693 (2000-11-01), Wollesen
patent: 6476444 (2002-11-01), Min
patent: 6802719 (2004-10-01), Finney
patent: 6852597 (2005-02-01), Park et al.
patent: 6929998 (2005-08-01), Chen et al.
patent: 2005/0001252 (2005-01-01), Kim et al.
patent: 2005/0173744 (2005-08-01), Kim et al.
patent: 2006/0237781 (2006-10-01), Marchant et al.
Lee Pei-Ing
Lin Jeng-Ping
Coleman W. David
Nanya Technology Corporation
Quintero Law Office
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