Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate
2008-12-04
2009-12-01
Smith, Zandra (Department: 2822)
Semiconductor device manufacturing: process
Making field effect device having pair of active regions...
Having insulated gate
C438S151000, C438S279000, C438S412000, C438S479000
Reexamination Certificate
active
07625798
ABSTRACT:
A semiconductor memory includes a plurality of memory cell transistors each having a laminated gate. A method of producing the semiconductor memory includes the steps of: forming a plurality of element separation regions for separating the memory cell transistors; forming a first conductive layer through a gate oxide film; etching the first conductive layer to form a plurality of slits; forming spacers on sidewall portions of each of the slits; forming a second conductive layer through an insulating film; etching the first conductive layer, the second conductive layer, and the insulating film using one single mask to form the laminated gate; implanting a conductive impurity into the semiconductor substrate exposed on both sides of the laminated gate to form a drain/source region; forming an interlayer insulating film; forming a contact hole penetrating the interlayer insulating film to reach the semiconductor substrate.
REFERENCES:
patent: 5559048 (1996-09-01), Inoue
patent: 6500710 (2002-12-01), Nakagawa
patent: 03-052267 (1991-03-01), None
patent: 03-126266 (1991-05-01), None
patent: 2004-055657 (2004-02-01), None
Duong Khanh B
Kubotera & Associates LLC
Oki Semiconductor Co., Ltd.
Smith Zandra
LandOfFree
Method of producing semiconductor memory does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of producing semiconductor memory, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of producing semiconductor memory will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4121915