Porous and dense hybrid interconnect structure and method of...

Details Porous and dense hybrid interconnect structure and method of... Porous and dense hybrid interconnect structure and method of...

2006-07-19

2009-06-09

Toledo, Fernando L (Department: 2895)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S639000, C257S758000, C257S760000

Reexamination Certificate

active

07544608

ABSTRACT:
A method for manufacturing a structure includes depositing a dense dielectric over the entire wafer, which includes areas that require low dielectric capacitance and areas that require high mechanical strength. The method further includes masking areas of the dense dielectric over the areas that require high mechanical strength and curing unmasked areas of the dense dielectric to burn out porogens inside the dense dielectric and transform the unmasked areas of the dense dielectric to porous dielectric material. A semiconductor structure comprises porous and dense hybrid interconnects for high performance and reliability semiconductor applications.

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