Spectrum based endpointing for chemical mechanical polishing

Abrading – Abrading process

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C451S006000, C451S036000, C451S041000, C451S059000, C451S063000

Reexamination Certificate

active

07614936

ABSTRACT:
Methods and apparatus for providing a flushing system for flushing a top surface of an optical head. The flushing system includes a source of gas configured to provide a flow of gas, a delivery nozzle, a delivery line that connects the source of gas to the delivery nozzle, a vacuum source configured to provide a vacuum, a vacuum nozzle, and a vacuum line that connects the vacuum source to the vacuum nozzle. The source of gas and the delivery nozzle are configured to direct a flow of gas across the top surface of the optical head. The vacuum nozzle and vacuum sources are configured so that the flow if gas is laminar.

REFERENCES:
patent: 5385612 (1995-01-01), Li
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5879626 (1999-03-01), Waterson et al.
patent: 6395130 (2002-05-01), Adams et al.
patent: 6488568 (2002-12-01), Treur et al.
patent: 6586337 (2003-07-01), Parikh
patent: 6599765 (2003-07-01), Boyd et al.
patent: 6618130 (2003-09-01), Chen
patent: 6645045 (2003-11-01), Ohkawa
patent: 6688945 (2004-02-01), Liu
patent: 6707540 (2004-03-01), Lehman et al.
patent: 6878039 (2005-04-01), Yang et al.
patent: 6916225 (2005-07-01), Sugiyama et al.
patent: 6922253 (2005-07-01), Moore
patent: 6942543 (2005-09-01), Kobayashi et al.
patent: 6953515 (2005-10-01), Boyd et al.
patent: 6991514 (2006-01-01), Meloni et al.
patent: 7169016 (2007-01-01), Barada et al.
patent: 7210980 (2007-05-01), Swedek et al.
patent: 7214122 (2007-05-01), Hirokawa et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Spectrum based endpointing for chemical mechanical polishing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Spectrum based endpointing for chemical mechanical polishing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Spectrum based endpointing for chemical mechanical polishing will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4074636

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.