Method of minimizing kerf width on a semiconductor substrate...

Details Method of minimizing kerf width on a semiconductor substrate... Method of minimizing kerf width on a semiconductor substrate...

2007-06-08

2009-11-03

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Making regenerative-type switching device

Having structure increasing breakdown voltage

C438S113000, C438S454000, C257S367000, C257S625000, C257S658000

Reexamination Certificate

active

07611927

ABSTRACT:
A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

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