Bonded structure and bonding method

Details Bonded structure and bonding method Bonded structure and bonding method

2006-07-24

2009-12-08

Monbleau, Davienne (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S780000, C257S781000, C257SE23015

Reexamination Certificate

active

07629688

ABSTRACT:
An aluminum wire is bonded to a silicon electrode by a wedge tool pressing the aluminum wire against the silicon electrode. In this way, a firmly bonded structure is obtained by sequentially stacking aluminum, aluminum oxide, silicon oxide, and silicon.

REFERENCES:
patent: 7323805 (2008-01-01), Sano et al.
patent: 2002/0072201 (2002-06-01), Potter
patent: 2002-027595 (2002-01-01), None
patent: 2005-193336 (2005-07-01), None

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