Method of fabricating semiconductor device and semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257SE27081

Reexamination Certificate

active

07569893

ABSTRACT:
A method includes preparing a semiconductor substrate having a cell region, a core NMOS region, and a core PMOS region; defining a cell active region, an NMOS active region, and a PMOS active region in the cell region, the core NMOS region, and the core PMOS region, respectively, by forming an isolation layer in predetermined regions of the semiconductor substrate; forming a cell gate pattern, an NMOS gate pattern, and a PMOS gate pattern crossing the cell active region, the NMOS active region, and the PMOS active region, respectively; forming an interlayer-insulating layer on the semiconductor substrate having the gate patterns; simultaneously forming a storage node landing pad, a bit line landing pad, and NMOS landing pads; and patterning the interlayer-insulating layer of the core PMOS region to form PMOS interconnection contact holes that expose predetermined regions of the PMOS active region adjacent to the PMOS gate pattern.

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English language translation of Japanese Publication No. 7-66297.
English language translation of Japanese Publication No. 11-186522.
English language translation of Korean Publication No. 2000-0015029.
English language translation of Korean Publication No. 2000-0021387.
English language translation of Korean Publication No. 10-2004-0033631.
English language translation of Korean Publication No. 10-2004-0069585.
English language translation of Korean Publication No.

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