Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With workpiece support
Reexamination Certificate
2000-08-31
2008-12-30
MacArthur, Sylvia R. (Department: 1792)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With workpiece support
C156S345110, C134S902000
Reexamination Certificate
active
07470344
ABSTRACT:
A method for dispensing a chemical, such as an edge bead removal solvent, onto a semiconductor wafer comprising the steps of dispensing the chemical selectively onto the wafer and applying a suction to the area immediately surrounding the location at which the chemical is dispensed onto the wafer. Preferably, the suction is applied substantially simultaneously with the dispensing of the chemical. One specific version of the invention provides an edge bead removal system wherein suction is applied to the area immediately surrounding the solvent dispensing nozzle to remove dissolved coating material and excess solvent from the wafer. In one aspect of this system, an apparatus for removing the edge bead includes a mechanism for dispensing a solvent selectively onto the edge of the wafer, and a mechanism surrounding the dispensing mechanism for vacuuming excess solvent and dissolved coating material from the edge of the wafer. The edge bead removal apparatus preferably also includes mechanisms for spinning the semiconductor wafer and coating material on the spinning wafer. Another aspect of the system provides a method for removing an edge bead of a coating of material that has been spun onto the surface of a semiconductor wafer. The method includes the steps of dispensing a solvent selectively onto the edge of the wafer to dissolve the coating material at the extreme edge of the wafer, and applying a suction to vacuum excess solvent and dissolved coating material from the wafer.
REFERENCES:
patent: 3834083 (1974-09-01), Hoshi et al.
patent: 3900866 (1975-08-01), Bell et al.
patent: 3939065 (1976-02-01), Ahlfors
patent: 4113492 (1978-09-01), Sato et al.
patent: 4314022 (1982-02-01), Fisch
patent: 4393807 (1983-07-01), Fujimura et al.
patent: 4510176 (1985-04-01), Cuthbert et al.
patent: 4518678 (1985-05-01), Allen
patent: 4522575 (1985-06-01), Tischer et al.
patent: 4557785 (1985-12-01), Ohkuma
patent: 4563840 (1986-01-01), Urakami
patent: 4576796 (1986-03-01), McCormick
patent: 4611553 (1986-09-01), Iwata et al.
patent: 4668334 (1987-05-01), Doornveld
patent: 4685975 (1987-08-01), Kottman et al.
patent: 4732785 (1988-03-01), Brewer
patent: 4790262 (1988-12-01), Nakayama et al.
patent: 4838979 (1989-06-01), Nishida et al.
patent: 4886728 (1989-12-01), Salamy et al.
patent: 4899685 (1990-02-01), Kawakami
patent: 4938239 (1990-07-01), Theurer et al.
patent: 4968375 (1990-11-01), Sato et al.
patent: 5013586 (1991-05-01), Cavazza
patent: 5103102 (1992-04-01), Economou et al.
patent: 5129579 (1992-07-01), Conte
patent: 5151219 (1992-09-01), Salamy et al.
patent: 5238713 (1993-08-01), Sago et al.
patent: 5279926 (1994-01-01), Chandler et al.
patent: 5289222 (1994-02-01), Hurtig
patent: 5294257 (1994-03-01), Kelly et al.
patent: 5358740 (1994-10-01), Bornside et al.
patent: 5362608 (1994-11-01), Flaim et al.
patent: 5378511 (1995-01-01), Cardinali et al.
patent: 5444921 (1995-08-01), Milina
patent: 5474807 (1995-12-01), Koshiishi
patent: 5580607 (1996-12-01), Takekuma et al.
patent: 5608943 (1997-03-01), Konishi et al.
patent: 5705223 (1998-01-01), Bunkofske
patent: 5756155 (1998-05-01), Tzeng et al.
patent: 5759427 (1998-06-01), Cibulsky et al.
patent: 5845662 (1998-12-01), Sumnitsch
patent: 5871584 (1999-02-01), Tateyama et al.
patent: 5952050 (1999-09-01), Doan
patent: 6311365 (2001-11-01), Dornier
patent: 6341387 (2002-01-01), Zars
patent: 6793764 (2004-09-01), Doan
patent: 1238766 (2002-09-01), None
patent: 56-73579 (1981-06-01), None
patent: 2-157763 (1990-06-01), None
patent: 03263343 (1991-11-01), None
patent: 5-175117 (1993-07-01), None
patent: 8-5825 (1996-01-01), None
patent: 08017708 (1996-01-01), None
Merriam-Webster Online “around”.
Official Translation of JP 08-017708 held to Sukenari Miyasono. The JP document publication date Jan. 19, 1996.
Merriam-Webster Online “around” also found in Merriam-Webster's Collegiate Dictionary, 10thEd. (1993).
““configure””,Merriam-Webster's Collegiate Dictionary, Tenth Edition, 242.
““configure””,American Heritage Electronic Dictionary, (1992).
““configure””,Merriam-Webster's Collegiate Dictionary, Tenth Edition, 242 (1993).
MacArthur Sylvia R.
Micro)n Technology, Inc.
Schwegman Lundberg & Woessner, P.A.
LandOfFree
Chemical dispensing system for semiconductor wafer processing does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Chemical dispensing system for semiconductor wafer processing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Chemical dispensing system for semiconductor wafer processing will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4042091