Stackable ball grid array

Details Stackable ball grid array Stackable ball grid array

2005-11-07

2008-12-02

Dang, Phuc T (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S737000, C257S738000, C257S686000, C361S735000, C361S790000, C361S767000, C438S106000, C438S109000

Reexamination Certificate

active

07459773

ABSTRACT:
A memory package having a plurality of vertically stacked ball grid arrays. Each of the vertically stacked ball grid arrays has a memory chip coupled thereto. Further, each of the plurality of ball grid arrays includes non-metal mateable alignment features. Each of the plurality of ball grid arrays is coupled to another of the plurality of ball grid arrays to from the vertically stacked memory package.

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