Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1995-07-14
1999-05-25
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257738, 257779, 257703, 257772, H01L 2348, H01L 2352, H01L 2940, H01L 2306
Patent
active
059071877
ABSTRACT:
In such electronic components as semiconductor packages and semiconductor chips which are possessed of groups of connecting bumps as input and output terminals, the groups of connecting bumps comprise not less than two kinds of connecting bumps different in melting point or not less than two kinds of connecting bumps different in mechanical strength. The groups of connecting bumps comprise connecting bumps made of high temperature solder or connecting bumps made of a high strength In type solder in the part of formation thereof. The connecting bumps made of high temperature solder are not directly affected by the influence of displacement because they retain the shape of a ball even after the step of connection such as solder reflow. The connecting bumps made of In type solder form connecting parts of high strength. These groups of connecting bumps contribute to exalt the reliability of the connecting parts without decreasing the number of input and output terminals.
REFERENCES:
patent: 3871015 (1975-03-01), Lin et al.
patent: 4536786 (1985-08-01), Hayakawa et al.
patent: 4604644 (1986-08-01), Beckham et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5569960 (1996-10-01), Kumazawa et al.
Iwase Nobuo
Iyogi Kiyoshi
Koiwa Kaoru
Yamakawa Koji
Yasumoto Taka-aki
Clark Jhihan B
Kabushiki Kaisha Toshiba
Saadat Mahshid D.
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