In situ substrate holder leveling method and apparatus

Details In situ substrate holder leveling method and apparatus In situ substrate holder leveling method and apparatus

2003-07-10

2008-08-19

Hassanzadeh, Parviz (Department: 1792)

Coating apparatus

Gas or vapor deposition

Work support

C156S345540

Reexamination Certificate

active

07413612

ABSTRACT:
Embodiments of the present invention are directed to adjusting the spacing between the substrate support and the faceplate of the gas distribution member to achieve improved uniformity of the layer formed on the substrate. One embodiment of the present invention is directed to a method of adjusting a spacing between a gas distribution member and a substrate support disposed generally opposite from the gas distribution member, wherein the substrate support is configured to support a substrate on which to form a layer with improved thickness uniformity. The method comprises forming a layer on the substrate disposed on the substrate support; measuring a thickness of the layer on the substrate; and calculating differences in thickness between a reference location on the substrate and a plurality of remaining locations on the substrate. The method further comprises computing spacing adjustment amounts for the remaining locations relative to the reference location based on the differences in thickness between the reference location and the remaining locations. The spacing adjustment amount is positive to increase the spacing between the substrate support at the location and the gas distribution member if the thickness is greater at the location than at the reference location. The spacing adjustment amount is negative to decrease the spacing between the substrate support at the location if the thickness is smaller at the location than at the reference location.

REFERENCES:
patent: 5543890 (1996-08-01), Tanaka et al.
patent: 5558717 (1996-09-01), Zhao et al.
patent: 5792269 (1998-08-01), Deacon et al.

Affiliated with

Also associated with

Rating

In situ substrate holder leveling method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with In situ substrate holder leveling method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and In situ substrate holder leveling method and apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4016447