Data processing: generic control systems or specific application – Specific application – apparatus or process – Product assembly or manufacturing
Reexamination Certificate
2007-05-15
2008-08-05
Shechtman, Sean P (Department: 2121)
Data processing: generic control systems or specific application
Specific application, apparatus or process
Product assembly or manufacturing
C700S108000, C700S121000, C700S175000, C438S007000, C451S005000, C451S006000
Reexamination Certificate
active
07409260
ABSTRACT:
A method for determining a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matching the spectra with indexes in a library and using the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.
REFERENCES:
patent: 5747380 (1998-05-01), Yu et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 6153116 (2000-11-01), Yang et al.
patent: 6172756 (2001-01-01), Chalmers et al.
patent: 6184985 (2001-02-01), Chalmers et al.
patent: 6190234 (2001-02-01), Swedek et al.
patent: 6204922 (2001-03-01), Chalmers
patent: 6271047 (2001-08-01), Ushio et al.
patent: 6296548 (2001-10-01), Wiswesser et al.
patent: 6358327 (2002-03-01), Pokharna et al.
patent: 6361646 (2002-03-01), Bibby, Jr. et al.
patent: 6489624 (2002-12-01), Ushio et al.
patent: 6623991 (2003-09-01), Johnson et al.
patent: 6676482 (2004-01-01), Bibby, Jr. et al.
patent: 6678046 (2004-01-01), Opsal
patent: 6678055 (2004-01-01), Du-Nour et al.
patent: 6762838 (2004-07-01), Du-Nour
patent: 6768967 (2004-07-01), Johnson et al.
patent: 6801321 (2004-10-01), Du-Nour
patent: 6806105 (2004-10-01), Johnson et al.
patent: 6806948 (2004-10-01), Katz et al.
patent: 6813034 (2004-11-01), Rosencwaig et al.
patent: 6819426 (2004-11-01), Sezginer et al.
patent: 6842259 (2005-01-01), Rosencwaig et al.
patent: 6885467 (2005-04-01), DuNour et al.
patent: 6898596 (2005-05-01), Aikens et al.
patent: 6947135 (2005-09-01), Johnson
patent: 7018271 (2006-03-01), Wiswesser et al.
patent: 7097537 (2006-08-01), David et al.
patent: 7255771 (2007-08-01), Chen et al.
patent: 2001/0039064 (2001-11-01), Ushio et al.
patent: 2002/0127951 (2002-09-01), Ishikawa et al.
patent: 2002/0173225 (2002-11-01), Wang et al.
patent: 2003/0022400 (2003-01-01), Nomoto et al.
patent: 2003/0053042 (2003-03-01), Chen
patent: 2003/0153246 (2003-08-01), Desai et al.
patent: 2003/0184732 (2003-10-01), Katz et al.
patent: 2003/0205664 (2003-11-01), Abe et al.
patent: 2005/0117164 (2005-06-01), Nomoto et al.
patent: 2006/0020419 (2006-01-01), Benvegnu
patent: 2006/0274326 (2006-12-01), Kobayashi et al.
patent: 2007/0039925 (2007-02-01), Swedek et al.
patent: 2007/0042675 (2007-02-01), Benvegnu et al.
patent: 1 176 631 (2002-01-01), None
patent: 2000-183001 (2000-06-01), None
patent: 2000-310512 (2000-11-01), None
patent: 2001-287159 (2001-10-01), None
patent: 2002-359217 (2002-12-01), None
patent: 2005-159203 (2005-06-01), None
patent: WO 00/54935 (2000-09-01), None
patent: WO 01/72470 (2001-10-01), None
patent: WO 2004/035265 (2004-04-01), None
Annex to Form PCT/ISA/206, Communication Relating to the Results of the Partial International Search, International Application No. PCT/US2006/032659, Feb. 6, 2007, 3 pp.
International Search Report and Written Opinion of the International Searching Authority, International Application Serial No. PCT/US2006/032659, May 16, 2007, 17 pp.
Benvegnu Dominic J.
David Jeffrey Drue
Karuppiah Lakshmanan
Lee Harry Q.
Swedek Boguslaw A.
Applied Materials Inc.
Fish & Richardson
Shechtman Sean P
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