Projection objective for a microlithographic projection...

Details Projection objective for a microlithographic projection... Projection objective for a microlithographic projection...

2006-07-28

2008-08-12

Berman, Jack I. (Department: 2881)

Radiant energy

Irradiation of objects or material

Irradiation of semiconductor devices

C250S492100, C359S649000, C359S396000, C359S656000, C359S675000, C359S798000

Reexamination Certificate

active

07411201

ABSTRACT:
A projection objective of a microlithographic projection exposure apparatus has a last optical element on the image side which is plane on the image side and which, together with an image plane of the projection objective, delimits an immersion space in the direction of an optical axis of the projection objective. This immersion space can be filled with an immersion liquid. At least one liquid or solid volume having plane-parallel interfaces can be introduced into the beam path of the projection objective, the optical thickness of the at least one volume being at least substantially equal to the optical thickness of the immersion space. By introducing and removing the volume, it is possible to convert the projection objective from dry operation to immersed operation in a straightforward way, without extensive adjustments to the projection objective or alignment work.

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