Method to planarize and reduce defect density of silicon...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Fluid growth from gaseous state combined with subsequent...

Reexamination Certificate

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C438S592000, C117S086000, C117S092000

Reexamination Certificate

active

07427556

ABSTRACT:
A method for blanket depositing a SiGe film comprises intermixing a silicon source, a germanium source and an etchant to form a gaseous precursor mixture. The method further comprises flowing the gaseous precursor mixture over a substrate under chemical vapor deposition conditions to deposit a blanket layer of epitaxial SiGe onto the substrate, whether patterned or un-patterned.

REFERENCES:
patent: 3602778 (1971-08-01), Ura et al.
patent: 3720877 (1973-03-01), Zarowin
patent: 3729645 (1973-04-01), Redington
patent: 3737739 (1973-06-01), Blakeslee et al.
patent: 3984718 (1976-10-01), Fein et al.
patent: 3984857 (1976-10-01), Mason
patent: 3985590 (1976-10-01), Mason
patent: 4461820 (1984-07-01), Shirai et al.
patent: 4656013 (1987-04-01), Hiai et al.
patent: 4699892 (1987-10-01), Suzuki
patent: 4786574 (1988-11-01), Shirai et al.
patent: 4803186 (1989-02-01), Chen et al.
patent: 4857270 (1989-08-01), Maruya et al.
patent: 4868014 (1989-09-01), Kanai et al.
patent: 4983274 (1991-01-01), Chen et al.
patent: 5037775 (1991-08-01), Reisman
patent: 5112439 (1992-05-01), Reisman et al.
patent: 5281274 (1994-01-01), Yoder
patent: 5281299 (1994-01-01), Escoffier et al.
patent: 5294285 (1994-03-01), Kanai et al.
patent: 5316958 (1994-05-01), Meyerson
patent: 5366554 (1994-11-01), Kanai et al.
patent: 5482557 (1996-01-01), Kanai et al.
patent: 5576247 (1996-11-01), Yano et al.
patent: 5646073 (1997-07-01), Grider et al.
patent: 5667586 (1997-09-01), Ek et al.
patent: 5818100 (1998-10-01), Grider et al.
patent: 6242080 (2001-06-01), Kondo
patent: 6451641 (2002-09-01), Halliyal et al.
patent: 6515219 (2003-02-01), Kondo
patent: 6646073 (2003-11-01), Farrer et al.
patent: 6709901 (2004-03-01), Yamazaki et al.
patent: 6875279 (2005-04-01), Chu et al.
patent: 7026219 (2006-04-01), Pomarede et al.
patent: 2002/0125471 (2002-09-01), Fitzgerald et al.
patent: 2002/0173130 (2002-11-01), Pomerede et al.
patent: 2003/0010978 (2003-01-01), Burden
patent: 2003/0045063 (2003-03-01), Oda
patent: 2003/0082300 (2003-05-01), Todd et al.
patent: 2003/0111013 (2003-06-01), Oosterlaken et al.
patent: 2003/0124818 (2003-07-01), Luo et al.
patent: 2003/0157787 (2003-08-01), Murthy et al.
patent: 2003/0207127 (2003-11-01), Murthy et al.
patent: 2003/0235931 (2003-12-01), Wada et al.
patent: 2005/0079692 (2005-04-01), Samoilov et al.
patent: 0858101 (1998-02-01), None
patent: 62017004 (1987-01-01), None
patent: WO 00/15885 (2000-03-01), None
Mayer, J. and Lau, S.S., Electronic Materials Science: For Integrated Circuits in Si and GaAs, 1990, Macmillan, p. 40.
Cannon, D. et al., “Tensile strained epitaxial Ge films on Si(100) substrates with potential application in L-band telecommunications,” Applied Physics Letter, vol. 84, No. 6, Feb. 9, 2004, pp. 906-908.
Colace, L. et al., “Efficient high-speed near-infrared Ge photodetectors integrated on Si substrates,” Applied Physics Letters, vol. 76, No. 10, Mar. 6, 2000, pp. 1231-1233.
Colace, L. et al., “Ge-on-Si Approaches to the Detection of Near-Infrared Light,” IEEE Journal of Quantum Electronics, vol. 35, No. 12, Dec. 1999, pp. 1843-1852.
Fama, S. et al., “High performance germanium-on silicon detectors for optical communications,” Applied Physics Letters, vol. 81, No. 4, Jul. 22, 2002, pp. 586-588.
Hull, R., “Metastable strained layer configurations in the SiGe/Si System,” (1999)EMIS Datareviews, SeriesNo. 24of SiGe and SiGe:C, edited by Erich Kasper et al., INSPEC (2000). London, UK.
Ishikawa, Y. et al., “Strain-induced band gap shrinkage in Ge grown on Si substrate,” Applied Physics Letters, vol. 82, No. 12, Mar. 31, 2003, pp. 2044-2046.
Lee et al., “Growth of strained Si and strained Ge heterostructures on relaxed Si1xGaxGaby ultrahigh vacuum chemical vapor deposition,” J. Vac. Sci. Technol. B 22(1) (Jan./Feb. 2004).
Li, Q, et al., “Selective growth of Ge on Si(100) through vias of SiO2 nanotemplate using solid source molecular beam epitaxy,” Applied Physics Letters, vol. 83, No. 24, Dec. 15, 2003, pp. 5032-5034.
Liu, J. et al., “Silicidation—induced band gap shrinkage In Ge epitaxial films on Si,” Applied Physics Letters, vol. 84, No. 5, Feb. 2, 2004, pp. 660-662.
Masini, G. et al., “High-Performance p-i-n Ge on Si Photodetectors for the Near Infrared: From Model to Demonstration,” IEEE Transactions of Electron Devices, vol. 48, No. 6, Jun. 2001, pp. 1092-1096.
Schollhorn et al., “Coalescence of geranium islands on silicon,” Thin Solid Films, vol. 336 (1988), pp. 109-111.

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