Heating and cooling of substrate support

Details Heating and cooling of substrate support Heating and cooling of substrate support

2005-08-24

2008-09-30

Fuqua, Shawntina (Department: 3742)

Electric heating

Heating devices

Combined with container, enclosure, or support for material...

C219S443100, C219S390000, C219S405000, C219S411000, C392S416000, C392S418000, C118S725000, C118S050100, C118S728000, C118S729000

Reexamination Certificate

active

07429718

ABSTRACT:
A substrate support assembly and method for controlling the temperature of a substrate within a process chamber are provided. A substrate support assembly includes an thermally conductive body comprising a stainless steel material, a substrate support surface on the surface of the thermally conductive body and adapted to support a large area substrate thereon, one or more heating elements embedded within the thermally conductive body, a cooling plate positioned below the thermally conductive body, a base support structure comprising a stainless steel material, positioned below the cooling plate and adapted to structurally support the thermally conductive body, and one or more cooling channels adapted to be supported by the base support structure and positioned between the cooling plate and the base support structure. A process chamber comprising the substrate support assembly of the invention is also provided.

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