Integrated circuit package bond pad having plurality of...

Details Integrated circuit package bond pad having plurality of... Integrated circuit package bond pad having plurality of...

2003-10-07

2008-05-13

Williams, Alexander Oscar (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257SE23030, C257SE21508, C257SE23144, C257SE23145, C257SE23020, C257SE23152, C257S701000, C257S700000, C257S698000, C257S696000, C257S781000, C257S773000, C257S779000, C257S780000, C257S750000, C257S751000, C257S173000

Reexamination Certificate

active

07372153

ABSTRACT:
An integrated circuit package bond pad includes an insulating layer and an electrode located over the insulating layer. The electrode has a first surface configured to be bonded to external circuitry and a second surface opposite the first surface. A plurality of conductive members is located in the insulating layer, wherein ones of the plurality of conductive members contact the second surface of the electrode.

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