Pattern formation method

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Forming nonplanar surface

Reexamination Certificate

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C430S324000, C430S315000

Reexamination Certificate

active

11009055

ABSTRACT:
In a pattern formation method, pattern exposure is performed by selectively irradiating, with exposing light, a resist film formed on a substrate and made of a resist including a carboxylic acid derivative. A first resist pattern is formed by developing the resist film after the pattern exposure, and subsequently, the first resist pattern is exposed to a solution including a reducing agent for reducing the carboxylic acid derivate. Thereafter, a water-soluble film including a crosslinking agent for causing crosslinking with a material of the first resist pattern is formed on the first resist pattern having been exposed to the solution. Subsequently, a crosslinking reaction is caused by annealing the water-soluble film between a portion of the water-soluble film and a portion of the first resist pattern in contact with each other on the sidewall of the first resist pattern, and then, a portion of the water-soluble film not reacted with the first resist pattern is removed. Thus, a second resist pattern made of the first resist pattern and a portion of the water-soluble film remaining on the sidewall of the first resist pattern is formed.

REFERENCES:
patent: 5858620 (1999-01-01), Ishibashi et al.
patent: 6319853 (2001-11-01), Ishibashi et al.
patent: 6503693 (2003-01-01), Mohondro et al.
patent: 2004/0028936 (2004-02-01), Kogiso et al.
patent: 10-073927 (1998-03-01), None
Ishibashi, T., et al. “Advanced Micro-Lithography Process with Chemical Shrink Technology.” Jpn. Journal of Applied Phys. vol. 40, 2001, pp. 419-425.

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