Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2008-04-29
2008-04-29
Whitehead, Jr., Carl (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S704000, C257S787000, C438S106000
Reexamination Certificate
active
10403565
ABSTRACT:
One embodiment of this invention pertains to multiple encapsulated thin-film electronic devices. These encapsulated devices include a substrate and multiple thin-film electronic devices are on this substrate. Each of the multiple thin-film electronic devices has an active area. The encapsulated devices also include an encapsulation layer that is on the substrate and this encapsulation layer has multiple holes and these multiple holes are over the active areas of the multiple thin-film electronic devices. The encapsulated devices also include multiple substantially flat encapsulation pieces that are on the encapsulation layer and these multiple substantially flat encapsulation pieces cover the multiple holes of the encapsulation layer. An absorbent material is not attached to any of the substantially flat encapsulation pieces.
REFERENCES:
patent: 5239228 (1993-08-01), Taniguchi et al.
patent: 5291038 (1994-03-01), Hanamoto et al.
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5686360 (1997-11-01), Harvey, III et al.
patent: 5693956 (1997-12-01), Shi et al.
patent: 5757126 (1998-05-01), Harvey, III et al.
patent: 5771562 (1998-06-01), Harvey, III et al.
patent: 5811177 (1998-09-01), Shi et al.
patent: 5874804 (1999-02-01), Rogers
patent: 5907477 (1999-05-01), Tuttle et al.
patent: 6028774 (2000-02-01), Shin et al.
patent: 6274927 (2001-08-01), Glenn
patent: 6428650 (2002-08-01), Chung
patent: 6441481 (2002-08-01), Karpman
patent: 6470594 (2002-10-01), Boroson et al.
patent: 6509636 (2003-01-01), Tsai et al.
patent: 6525405 (2003-02-01), Chun et al.
patent: 6545332 (2003-04-01), Huang
patent: 6566745 (2003-05-01), Beyne et al.
patent: 6627872 (2003-09-01), FuKamura et al.
patent: 6661084 (2003-12-01), Peterson et al.
patent: 6713857 (2004-03-01), Tsai
patent: 6774481 (2004-08-01), Ono
patent: 6900531 (2005-05-01), Foong et al.
patent: 7002241 (2006-02-01), Mostafazadeh et al.
patent: 2002/0024131 (2002-02-01), Sasano
patent: 2002/0027296 (2002-03-01), Badehi
patent: 2003/0098912 (2003-05-01), Hosokai et al.
patent: 2003/0124762 (2003-07-01), Hashimoto
patent: 2004/0012698 (2004-01-01), Suda et al.
patent: 2004/0038442 (2004-02-01), Kinsman
patent: 2004/0124486 (2004-07-01), Yamamoto
patent: 353079469 (1978-07-01), None
patent: 402020045 (1990-01-01), None
patent: 402105443 (1990-04-01), None
patent: 405055395 (1993-03-01), None
patent: 2001068265 (2001-03-01), None
patent: 00/24126 (2000-04-01), None
patent: 01/18886 (2001-03-01), None
Jr. Carl Whitehead
Mitchell James M
Osram Opto Semiconductors GmbH
LandOfFree
Encapsulation of thin-film electronic devices does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Encapsulation of thin-film electronic devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulation of thin-film electronic devices will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3950164