Plasma treatment of O-rings

Details Plasma treatment of O-rings Plasma treatment of O-rings

1993-01-07

1994-07-12

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156668, 20419235, 20419236, B05D 500

Patent

active

053285573

ABSTRACT:
A method for treating an O-ring to substantially eliminate the adhesion of wafers to the O-ring in semiconductor equipment, which method comprises the steps of: placing an O-ring in a reactor, exposing the O-ring to an ionizing gas for approximately two minutes, and placing the O-ring in the instrument in which the O-ring will function.

REFERENCES:
patent: 4064030 (1977-12-01), Nakai et al.
patent: 4337279 (1982-06-01), Polak
patent: 4379180 (1983-04-01), Baglin et al.
patent: 4410586 (1983-10-01), Ladizesky et al.
patent: 4416724 (1983-11-01), Fischer
patent: 4568598 (1986-02-01), Bilkadi et al.

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