Structure and method for accurate deep trench resistance...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S301000

Reexamination Certificate

active

10904528

ABSTRACT:
A test structure for implementing resistance measurement of a deep trench formed in a semiconductor device includes a pair of deep trenches formed within a semiconductor substrate. The pair of deep trenches has a dielectric material formed on side and bottom surfaces thereof, and includes a conductive fill material therein. Bottom portions of the pair of deep trenches are merged with one another so as to provide an electrically conductive path therethrough.

REFERENCES:
patent: 5448090 (1995-09-01), Geissler et al.
patent: 6495883 (2002-12-01), Shibata et al.
patent: 6627513 (2003-09-01), Tsai et al.
patent: 6759702 (2004-07-01), Radens et al.
patent: 2004/0198014 (2004-10-01), Wu et al.
patent: 2004/0256729 (2004-12-01), Agarwala et al.
patent: 2005/0101094 (2005-05-01), Kito et al.
patent: 2005/0127422 (2005-06-01), Hsiao et al.
patent: 2005/0176198 (2005-08-01), Kudelka

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