Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2008-03-18
2008-03-18
Smith, Bradley K. (Department: 2891)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C430S315000
Reexamination Certificate
active
10408428
ABSTRACT:
Photoresist compositions and methods suitable for depositing a very thick photoresist layer in a single coating process are provided. Such photoresist layers are particularly suitable for use in chip scale packaging.
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Clifford Hamel, Karl Suss America, Inc., Waterbury Center, VT, pp. 1-12.
Forman Robert S.
Huenger Eric C.
Steeper Jill E.
Baskin Jonathan D.
Shipley Company L.L.C.
Smith Bradley K.
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