Spectra based endpointing for chemical mechanical polishing

Details Spectra based endpointing for chemical mechanical polishing Spectra based endpointing for chemical mechanical polishing

2008-07-29

2008-07-29

Deo, Duy-Vu N (Department: 1792)

Data processing: measuring, calibrating, or testing

Measurement system

Dimensional determination

C702S172000, C702S188000, C702S189000

Reexamination Certificate

active

11261742

ABSTRACT:
Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting two or more reference spectra. Each reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectra is selected for particular spectra-based endpoint determination logic so that the target thickness is achieved when endpoint is called by applying the particular spectra-based endpoint logic. The method includes obtaining two or more current spectra. Each current spectrum is a spectrum of white light reflected from a film of interest on a second substrate when the film of interest is being subjected to a polishing step and has a current thickness that is greater than the target thickness. The method includes determining, for the second substrate, when an endpoint of the polishing step has been achieved.

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